5a | 高温工作High Temperature Operating Life HTOL | HTOL1 | D,G,X,Y | 26 | 3 Note B | 0 | JEDEC JESD22-A108 | Only for LED and Laser Component
Duration 1000 h at maximum Specified Tsolder,choose corresponding drive current according to derating curve to achieve max Tj defined in the part specification.Test 5a is equivalent to 5b if no derating.For use within specical application; a longer test duration my be needed to ensure reliability over aplication lifetime.For details,see Appendix 7a"Reliability Validation for LEDs"
Test before and after HTOL1 |
5b | 高温工作High Temperature Operating Life HTOL | HTOL2 | D,G,X,Y | 26 | 3 Note B | 0 | JEDEC JESD22-A108 | Only for LED and Laser Component
Duration 1000 h at maximum Specified drive current,Choose corresponding Tsolder according to derating curve to achieve max Tj defined in the part specification.Test 5b is equivalent to 5a if no derating.For use within specical application; a longer test duration my be needed to ensure reliability over aplication lifetime.For details,see Appendix 7a"Reliability Validation for LEDs"
Test before and after HTOL2 |
7 | 温度循环Temperature Cycling | TC | D,G | 26 | 3 Note B | 0 | JEDEC JESD22-A104 | PC before TC
Duration 1000 cycles.Minimum soak & dwell time 15 min.Minimum temperature as specified in part specification. Choose TC condition exceeding or equal to the operating temperature according to the apporopriate part specification:
TC condition 1:max Tsolder=85℃
TC condition 2:max Tsolder=100℃
TC condition 3:max Tsolder=110℃
TC condition 4:max Tsolder=125℃
TC condition and tranfer time shall be mentioned in the test report.
It is recommended to decapsulate the part after TC and perform WBP if applicable.Report data.The supplier has to provide explanation in case that WBP cannot be performed.
TEST before and after TC. |
6a | 高温高湿Wet High Temperature Operating Life | WHTOL1 | D,G,X,Y | 26 | 3 Note B | 0 | JEDEC JESD22-A101 | Only for LED and Laser Component
PC before WHTOL1
Duration 1000 h at Tsolder=85℃/85%RH with drive current according to derating curve to achieve max Tj defined in the part specification.Operated with power cycle 30 min on /30 min off
Test before and after WHTOL1,DPA after WHTOL1 |
6b | 高温高湿Wet High Temperature Operating Life | HTOL2 | D,G,X,Y | 26 | 3 Note B | 0 | JEDEC JESD22-A101 | Only for LED and Laser Component
PC before WHTOL2
Duration 1000 h at Tsolder=85℃/85%RH with minimum drive current according to part specification.If no minimum rated drive current is specified, a drive current shall be chosen not to exceed a rise of 3K for Tjunction.
Test before and after WHTOL2,DPA after WHTOL2 |
8a | 功率温度循环Power Temperature Cycling | PTC | D,G,X,Y | 26 | 3 Note B | 0 | JEDEC JESD22-A105 | Only for LED and Laser Component
PC before PTC
Duration 1000 temperature cycles with drive current according to derating curve to achieve max Tj specified in part specification.
Operated with power cycle 5 min on/ 5 min off.
Minimum temperature as specified in part specification. For maximum temperature choose:
PTC condition 1:max Tsolder=85℃
PTC condition 2:max Tsolder=105℃
PTC condition 3:max Tsolder=125℃
PTC condition should be chosen closest to the operating temperature range within the appropriate part specification. PTC condtion shall be mentioned in the test report. For use within special application; a longer test duration may be needed to ensure reliability over application liftime.For details.see Appendix 7a "Reliability Validation for LEDs"
TEST before and after PTC.DPA after PTC. |
11 | DPA Destructive Physical Analysis | DPA | D,G | 2(for each test) | 1 Note B | 0 | Appendix 6 | Random sample of parts that have successfully completed PTC/IOL.WHTOL/H3TRB,H2S,and FMG(2 samples each) |
24 | 热阻Thermal Resistance | TR | D,G,X,Y | 10 each,pre-&post-change | 1 | 0 | JEDEC
JESD51-50
JESD51-51
JESD51-52 | Measure thermal resistance according to JESD51-50, JESD51-51,and JESD51-52 to assure specification compliance. |